Ansys is joining the Intel Foundry Accelerator USMAG Alliance to support the design of secure and efficient chips for national security and government applications. Through this alliance, Ansys' semiconductor simulation tools will be optimized to deliver secure design methodologies and workflows to meet the requirements of Intel Foundry's process design kits (PDKs) — essential to fully achieve the requirements of military, aerospace, and government applications.
Ansys is deepening its technical collaboration with Intel Foundry by developing an enhanced thermal management flow with the RedHawk-SC platform, supporting the Intel 18A silicon manufacturing process. Intel 18A features revolutionary backside power delivery technology, PowerVia, that comes with new challenges for effectively cooling circuits, especially for high-performance computing, artificial intelligence (AI), and graphics processor chips. Ansys' mature and well-proven thermal solver technology provides predictive accuracy and the capacity for full-system analysis, resulting in better performance and greater design flexibility.
In addition, Intel Foundry and Ansys are collaborating to deliver signoff verification of thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB) assembly technology. These capabilities span use-cases ranging from advanced silicon process nodes to various heterogenous packaging platforms.
"Ansys has worked with Intel Foundry to address complex multiphysics challenges and meet stringent thermal, power, mechanical, and reliability requirements," says John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "Ansys' deep background in physics simulation addresses the very advanced requirements of military and aerospace products. Thanks to the collaboration between our companies, we can deliver greater value to our mutual customers."
Latest from Defense and Munitions
- Pacific Defense expanding Manufacturing and Design Engineering Center
- Iscar's CERMILL endmills with ceramic round inserts
- November Lunch + Learn with Fagor Automation
- Ellison Technologies to represent Tornos in 15 U.S. states
- Molex acquiring AirBorn, expanding position in aerospace and defense market
- Tungaloy’s TungBoreMini drilling and turning tool
- IMTS 2024 Booth Tour: Okuma America Corp.
- Making the connected battlefield a reality