SMART Modular Technologies, Inc.
SMART Modular Technologies, Inc., a Penguin Solutions, Inc. brand and a global leader in integrated memory solutions, solid-state drives, and hybrid storage products, announced its new ruggedized T6EN PCIe/NVMe flash drives for aerospace, defense, and industrial applications. This new family of SSDs is available in U.2, E1.S and M.2 2280 form factors, enabling flexibility for end users based on their specific application and configuration needs.
These T6EN SSDs offer capacities up to 15TB (terabytes) for the U.2 version and up to 8TB for the E1.S and M.2 2280 versions. All three versions utilize 3D TLC flash memory.
“Our new T6EN SSDs deliver a rich, ruggedized feature set coupled with our proprietary security algorithms, erase trigger, and hardware write-protection,” explains Mike Guzzo, senior director of SMART’s RUGGED line of flash products.
Delivering a more robust SSD starts at the design stage, where SMART specifies higher margins for routing of signals, thicker PCBs, and more durable enclosures. During the engineering and development process, SMART selectively sources only the highest reliability components and performs deep integration testing – including 8-hour burn-in testing under wide degrees of temperature variation - to ensure conformance with all requirements for secure, ruggedized storage.
All versions of the T6EN SSDs feature AES-XTS 256-bit encryption that automatically protects data written to the drive. They are also OPAL 2.0 compliant, providing an industry-standard security protocol to protect data on the SSDs from being accessed by unauthorized users.
From an operating environment perspective, SMART’s T6EN SSDs are designed to ensure operation under extreme temperature and operating conditions in support of applications that require reliability, durability and secure memory storage. For an additional layer of protection against environmental issues, conformal coating is an available option for all versions to provide even further protection against moisture, thermal shock, static, vibration, and contamination.